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EBSO
SPA 300-F / 400 F

Please find below additional information on the above equipment, together with relevant contact details should you require additional data.

 
Product Picture 1
Product Picture 2
 
     
 

Machine Type

Max PCB Size

Solder Method

StandAlone
upto 450mm
Point to Point
 
   
 
1Single and Dual Nozzle System, Wetable Nozzle Technology
  1Spray and Microdrop Fluxing
  1IR bottom Preheat
  1Easy Offline Programming with image editing
  1Tin Level Control and automatic Solder wire Feeder  
  1Fast ROI  
     
     
   Back to results..  
     
 

Supplier Contact Details:

 
Supplier Logo
Company:
EBSO GmbH
Contact:
Frank Sommer
Telephone:
0049 7273 93580
Fax:
0049 7273 935828
Email
Web: