EBSO
SPA 500 Modular

Please find below additional information on the above equipment, together with relevant contact details should you require additional data.

Machine Type	Max PCB Size	Solder Method
Inline	over 450mm	Multi Dip

2 Solder Pots, Multi Nozzle and Single Nozzle System

Dipping and Drag Soldering under 0° or 7°

top and bottom Preheat

QUICK RELEASE Pum System, easy to maintain

Closed loop Servo drive Portal System

Spray and Microdrop Fluxing